The Eduladder is a community of students, teachers, and programmers just interested to make you pass any exams. So we help you to solve your academic and programming questions fast.
In eduladder you can Ask,Answer,Listen,Earn and Download Questions and Question papers.
Watch related videos of your favorite subject.
Connect with students from different parts of the world.
Apply or Post Jobs, Courses ,Internships and Volunteering opportunity. For FREE
See Our team
Wondering how we keep quality?
Got unsolved questions? Ask Questions


You are here:Open notes-->Seminar-topics-and-ppt-for-engineering-->Integrated-Power-Electronics-Module

Integrated Power Electronics Module

How to study this subject

In power electronics, solid-state electronics is used for the control and conversion of electric power .The goal of power electronics is to realize power conversion from electrical source to an electrical load in a highly efficient, highly reliable and cost effective way. Power electronics modules are key units in a power electronics system. These modules contain integration of power switches and associated electronic circuitry for drive control and protection and other passive components.

During the past decades, power devices underwent generation-by-generation improvements and can now handle significant power density. On the other hand power electronics packaging has not kept pace with the development of semiconductor devices. This is due to the limitations of power electronics circuits. The integration of power electronics circuit is quite different from that of other electronics circuits. The objective of power electronics circuits is electronics energy processing and hence require high power handling capability and proper thermal management.

Most of the currently used power electronic modules are made by using wire-bonding technology [1,2]. In these packages power semi conductor dies are mounted on a common substrate and interconnected with wire bonds. Other associated electronic circuitries are mounted on a multi layer PCB and connected to the power devices by vertical pins. These wire bonds are prone to resistance, parasitic and fatigue failure. Due to its two dimensional structure the package has large size. Another disadvantage is the ringing produced by parasitic associated with the wire bonds

Official Notes


Add contents here

Notes from other sources


Integrated Power Electronics Module.doc


Model question papers


Add contents here

Previous year question papers


Add contents here

Useful links


Add contents here

Editors

RajivRajiv


You might like this video:Watch more here

Watch more videos from this user Here

Learn how to upload a video and start earning here